License to Connect.

Thanks to the immense transmission capacity and low energy consumption, optical communication is penetrating ever deeper layers of data/communication networks. Servers are increasingly connected via glass fibres, peripherals are starting to leverage photonic cables that combine high capacity and convenient lengths, and soon computers will see internal functionalities transferred to the medium of light in form of integrated photonic circuits (PICs). The important new field of silicon photonics requires that these new components must be tested and assembled with the highest precision since a misalignment would mean lost yield, poor performance or failure.

It is the groundbreaking active alignment systems from PI that make this process economically viable. PI’s unique technology can collapse lengthy, sequential, looping alignment processes into as few as one brief step. This reduces the processing time for accurate alignment by typically a factor of 100. PI’s modular architecture and fab-ready mechanics and controls make the Total Cost of Ownership (TCO) dramatically lower. This is why PI is at the heart of industry-enabling tools such as those we spotlight below.

Technology of Active Alignment
The development and manufacturing of photonic integrated circuits (PIC) or of silicon photonic (SiP) components reminds us in many ways of the early years of the semiconductor industry.
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The Missing Link
TEGEMA B.V. (NL), the multidisciplinary system integrator, has developed a modular machine platform for the automated assembly of optical components, in particular of photonically integrated circuits (PICs).
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SiPh Wafer Probing Powered by PI
The integration of photonic structures or elements on a silicon chip presents, already at wafer level, a multitude of new challenges for the testing technology of these elements.
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Do you have questions about our solutions? Our specialists are happy to help you!